1～12 件を表示 ／ 全 12 件
Achieve optimal lighting with a triple optical system and integrated lighting!
This is an automatic inspection machine for the cross-sectional profile shape inspection of the outer edge of a 300mm wafer and for the image defect inspection around the entire edge. It allows for review inspection of edge defects and can create image files. For more details, please download and view the catalog.
Low price compared to other companies without reducing measurement resolution!
We will simultaneously capture images of the edge surfaces and the top and bottom surfaces of the wafer's outer circumference to inspect for scratches, foreign objects, cracks, and chip defects. The inspection wafer is adhered, and the camera recognizes the wafer shape, such as notches and orifices, to optimize drive control. The newly developed triple optical system and integrated lighting achieve optimal illumination for image processing. The inspection time is fast, taking only 10 seconds per wafer. With external communication capabilities, it can be integrated directly into an automatic machine. For more details, please download and view the catalog.
High-precision cleanroom-compatible auto-review microscope
This is an autofocus microscope that inspects fine chip defects on MEMS wafers. The autofocus microscope is mounted on the XYZ electric body. By placing the wafer and controlling the XYZ stage with software, it can inspect the device chip on the wafer and input focused images of defect locations at the optimal magnification for inspection. For more details, please download and view the catalog.
We will perform auto-alignment and automatic inspection with a high throughput of 30 seconds per sheet.
The terrace width and edges on the top surface of the wafer's outer circumference can be measured and inspected for defects using a line camera. When the wafer is placed on the set plate, auto-alignment and automatic inspection are performed at a high throughput of one wafer every 30 seconds. For more details, please download and view the catalog.
An inline board appearance inspection machine that can automatically inspect surface and back defects on a panel manufacturing line.
The "front and back appearance inspection device" is an inline substrate appearance inspection machine. It is installed above and below the inspection substrate to detect the running substrate with sensors and perform appearance inspection using a line camera. For more details, please download the catalog or contact us.
Ideal for foreign matter inspection of substrates after cleaning, internal defect inspection of glass substrates, and length measurement inspection of transparent electrode patterns.
We inspect the minute defects of various products such as panel substrates, films, and semiconductor components in the diversifying industrial sector using the latest line sensor appearance inspection system. By integrating mechanical, optical, and image processing technologies through cutting-edge optical alliance technology, we propose a unique high-speed and high-precision inspection machine. This appearance inspection machine is equipped with inspection units that cover a range from micro to macro, allowing for various inspections, and can be constructed with multifunctional units for inspection, review, processing, and adjustments tailored to specific purposes. For more details, please download the catalog or contact us.
It is a cassette-to-cassette type wafer edge automatic inspection machine.
It is a cassette-to-cassette type wafer edge automatic inspection machine. It achieves a high throughput with a 10-second inspection time per wafer and a 30-second takt time. A robot takes out one wafer at a time from a cassette that holds 25 wafers, performs automatic alignment, inspects it, and then stores it back in the cassette. The operation is simple.
It is a high-precision XYZ auto stage.
Automatically inspects chip element defects on wafers. The system controls a microscope color camera and auto stage to automatically identify defects at the chip element level. For more details, please download and view the catalog.
Inspection data files and defect image files can be displayed using judgment or macro MAP.
It is a high-speed automatic inspection machine for sapphire wafer defects and foreign material defects. It uses a double cassette system to load, inspect, and unload at a cycle time of 30 seconds per wafer. For more details, please download and view the catalog.
It can be installed on the existing manufacturing line to perform image inspection of the electrode part.
The panel electrode inspection machine inspects the disconnection/semi-disconnection of the G electrode lines on the transport substrate in the panel manufacturing line. It sets up a bridge on the conveyor and inspects the large panel's electrode lines moving at 300mm/second from two locations on the top, using high-speed line cameras and optical systems with a resolution of 5μm. For more details, please download and view the catalog.
Measurement of ITO film on PET film with a resolution of 1μm. Inspection device equipped with image autofocus function.
This is an appearance inspection device for ITO films on PET film. It allows for clear observation of the presence or absence of the ITO film using a halation optical system, and it is easy to operate. The optical system movement to specified coordinates and imaging/measurement are controlled by the system. It also features an image auto-focus function. For more details, please download the catalog or contact us.
Microscope-type non-contact height/step/thickness measuring instrument compatible with 300mmφ wafers.
High-precision measurements can be performed semi-automatically with image detection of the target's left and right lines and automatic control of the Z-axis. For more details, please download the catalog or contact us.
